High Heat Resistance
Packaging Available
60L Open Top
220L Open Top
High Heat Resistance
JALBOND DFL
Board-to-Film Dry Lamination Adhesive
Jalbond DFL is a water-based dry lamination adhesive developed for board-to-film applications, offering good wetting and low foaming performance on high-speed machines. Its high heat resistance supports reliable performance during demanding lamination processes.
Key Features
- Water-based formulation
- Good wetting
- Low foaming on high-speed machines
- High heat resistance
- Suitable for board-to-film lamination
Applications
- Board-to-Film Lamination
- Dry Lamination Applications
Technical Specifications
| Property | Typical Value |
|---|---|
| Appearance | Bluish Translucent Emulsion |
| Viscosity | <10 Ps |
| pH | 5 – 7 |